Sony uses heat pipes and thermal paste to keep Xperia Z5 cool

Sony chose to stick with Qualcomm’s Snapdragon 810 chip for its new Xperia Z5 lineup, despite the obvious heat issues. But to ensure fans don’t have to suffer those again, Sony is using heat pipes and thermal paste to keep the Xperia Z5 cool. That’s right — the methods normally used to keep desktop-class processors and graphics

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Source: Cult of Android